The XC6SLX45T-3FGG484I from Xilinx, now part of AMD, is a Spartan-6 LXT field-programmable gate array manufactured using a cost- and power-optimized 45nm process. It integrates 43,661 logic cells, 6,822 configurable logic slices, 54,576 flip-flops, and up to 401Kb of distributed RAM for complex logic, interface expansion, and parallel-processing designs.
The device includes 58 DSP48A1 slices and 116 18Kb Block RAM blocks, providing a total Block RAM capacity of 2,088Kb. Each DSP48A1 slice includes an 18×18 multiplier, an adder, and an accumulator for digital filtering, arithmetic processing, and control algorithms.
XC6SLX45T integrates four GTP high-speed serial transceivers, each supporting data rates up to 3.2Gb/s, together with one integrated Endpoint block compliant with PCI Express Base Specification 1.1. It also provides four clock-management tiles and up to two memory-controller blocks supporting DDR, DDR2, DDR3, and LPDDR interfaces.
This part is supplied in a 484-ball lead-free FGG BGA package. The FGG484 device-package combination provides up to 296 user I/Os and four GTP transceivers. The package measures approximately 23 × 23mm and has a 1.0mm ball pitch.
The “-3” suffix identifies the speed grade, while the final “I” specifies the industrial temperature grade, supporting a junction-temperature range from -40°C to +100°C. Spartan-6 LXT -3 devices use the 1.2V core-voltage specification.
Key Specifications:
- Manufacturer: Xilinx／AMD
- Manufacturer Part Number: XC6SLX45T-3FGG484I
- Product Family: Spartan-6 LXT
- Device Type: Field-Programmable Gate Array
- Process Technology: 45nm
- Logic Cells: 43,661
- Configurable Logic Slices: 6,822
- Flip-Flops: 54,576
- Maximum Distributed RAM: 401Kb
- DSP48A1 Slices: 58
- 18Kb Block RAM Blocks: 116
- Total Block RAM: 2,088Kb
- GTP Transceivers: 4
- Maximum GTP Data Rate: 3.2Gb/s
- User I/O in FGG484 Package: 296
- Clock-Management Tiles: 4
- Memory-Controller Blocks: Up to 2
- PCI Express Endpoint Blocks: 1
- Speed Grade: -3
- Core-Voltage Specification: 1.2V
- Temperature Grade: Industrial
- Junction-Temperature Range: -40°C to +100°C
- Package: FGG484 Lead-Free BGA
- Package Dimensions: Approximately 23 × 23mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount
Typical Applications:
Suitable for industrial automation, communication interfaces, protocol bridging, PCI Express devices, data acquisition, machine control, digital signal processing, memory interfaces, and embedded systems. Power sequencing, thermal conditions, I/O standards, high-speed signal integrity, and development-tool compatibility should be verified in the final design.
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