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XC7K325T-2FFG900I Xilinx Kintex-7 FPGA 326,080 Logic Cells FFG900 Industrial Grade
XC7K325T-2FFG900I Xilinx Kintex-7 FPGA 326,080 Logic Cells FFG900 Industrial Grade - 图片 2
XC7K325T-2FFG900I Xilinx Kintex-7 FPGA 326,080 Logic Cells FFG900 Industrial Grade - 图片 3
XC7K325T-2FFG900I Xilinx Kintex-7 FPGA 326,080 Logic Cells FFG900 Industrial Grade - 图片 4

XC7K325T-2FFG900I Xilinx Kintex-7 FPGA 326,080 Logic Cells FFG900 Industrial Grade

原价为：$70.00。当前价格为：$68.00。

The Xilinx XC7K325T-2FFG900I is an industrial-grade Kintex-7 FPGA featuring 326,080 logic cells, 840 DSP slices, 16,020Kb Block RAM, 16 GTX transceivers, and up to 500 user I/Os in an FFG900 package.

剩余量： 库存 100000 件

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SKU： XC7K325T-2FFG900I 分类： 品牌：

The XC7K325T-2FFG900I from Xilinx, now part of AMD, is a Kintex-7 field-programmable gate array manufactured using a 28nm high-performance, low-power process. It integrates 326,080 logic cells, 50,950 CLB slices, 840 DSP48E1 slices, and 16,020Kb of Block RAM, providing substantial programmable resources for complex embedded and parallel-processing designs.

The device includes 16 GTX high-speed serial transceivers, up to 500 user I/Os, 10 clock-management tiles, one PCI Express interface block, and one XADC block. The Kintex-7 PCIe integrated block supports configurations up to x8 Gen2, while the XADC incorporates dual 12-bit, 1MSPS analog-to-digital converters for system monitoring and analog data acquisition.

XC7K325T-2FFG900I is supplied in an FFG900 flip-chip BGA package measuring approximately 31 × 31mm with a 1.0mm ball pitch. The “-2” suffix identifies the speed grade, while “I” specifies an industrial junction-temperature range of -40°C to +100°C. The “G” package designation indicates a lead-free package meeting RoHS 6/6 requirements with Exemption 15.

With its combination of programmable logic, DSP resources, on-chip memory, high-speed transceivers, and PCIe connectivity, this FPGA is commonly suited to industrial control, communications infrastructure, video and image processing, test and measurement, data acquisition, digital signal processing, and hardware acceleration. Power sequencing, thermal management, I/O standards, and timing requirements should be validated for each design.

Key Specifications:

  • Manufacturer: Xilinx / AMD
  • Manufacturer Part Number: XC7K325T-2FFG900I
  • Product Family: Kintex-7
  • Device Type: Field-Programmable Gate Array
  • Process Technology: 28nm
  • Logic Cells: 326,080
  • CLB Slices: 50,950
  • Maximum Distributed RAM: 4,000Kb
  • DSP48E1 Slices: 840
  • Total Block RAM: 16,020Kb
  • 18Kb Block RAM Blocks: 890
  • 36Kb Block RAM Blocks: 445
  • GTX Transceivers: 16
  • Maximum User I/O: 500
  • Clock Management Tiles: 10
  • PCI Express Blocks: 1, supporting up to x8 Gen2
  • XADC Blocks: 1
  • Speed Grade: -2
  • Temperature Grade: Industrial
  • Junction Temperature Range: -40°C to +100°C
  • Package: FFG900
  • Package Dimensions: Approximately 31 × 31mm
  • Ball Pitch: 1.0mm
  • Mounting Type: Surface Mount
  • Environmental Classification: Lead-Free, RoHS 6/6 with Exemption 15

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