The CYBLE-022001-00 from Infineon is a highly integrated AIROC™ Bluetooth® Low Energy module based on a PSoC™ 4 MCU with AIROC™ Bluetooth LE technology. It features a 32-bit Arm® Cortex®-M0 processor running at up to 48MHz and provides an integrated wireless solution for low-power Bluetooth connectivity applications.
The module integrates 128KB Flash and 16KB SRAM with up to 16 programmable GPIOs. Its programmable architecture supports ADCs, timers, counters and PWM functions, along with configurable I²C, SPI and UART interfaces. It also includes a 12-bit SAR ADC operating at up to 1Msps, four dedicated 16-bit timer/counter/PWM blocks and CapSense™ capacitive-touch functionality.
The CYBLE-022001-00 includes a royalty-free Bluetooth LE stack compatible with Bluetooth® Core Specification 5.1, supporting GAP Central, Peripheral, Observer and Broadcaster roles. The radio operates in the 2.4GHz ISM band, with configurable transmit power from approximately -18dBm to +3dBm and typical receiver sensitivity of approximately -87dBm.
On-board crystal oscillators, a chip antenna and required passive components are integrated into the module, reducing external RF design requirements. The device measures only 10 × 10 × 1.80mm and uses a 21-pad SMT / LG-MLGA-21 module package. It has regulatory certifications or qualifications including FCC, ISED, MIC, KC, CE and Bluetooth SIG.
Low-power modes include approximately 1.3μA Deep Sleep operation and approximately 150nA Hibernate current. The module is rated for -40°C to +85°C operation, and the datasheet specifies module characteristics across approximately 1.71V to 5.5V operating conditions. Infineon’s current product page lists the CYBLE-022001-00 as END OF LIFE / Discontinued.
Key Specifications:
- Brand: Infineon
- Part Number: CYBLE-022001-00
- Family: AIROC™ Bluetooth® Modules
- Product Type: Bluetooth Low Energy Module
- Bluetooth Version: Bluetooth® 5.1
- Bluetooth Classic: No
- Base Silicon: PSoC™ 4 MCU with AIROC™ Bluetooth LE
- CPU Core: Arm® Cortex®-M0
- Maximum CPU Frequency: 48MHz
- Flash Memory: 128KB
- SRAM: 16KB
- GPIOs: Up to 16
- ADC: 12-Bit SAR, up to 1Msps
- Timer / PWM: 4 × 16-Bit TCPWM
- CapSense™: Yes
- I²C: Configurable
- SPI: Configurable
- UART: Configurable
- I²S: Supported
- RF Frequency: 2400 to 2480MHz
- TX Output Power: -18dBm to +3dBm
- Typical RX Sensitivity: Approx. -87dBm
- Antenna: Integrated Chip Antenna
- Deep Sleep Current: Approx. 1.3μA
- Hibernate Current: Approx. 150nA
- Operating Voltage: Approx. 1.71V to 5.5V
- Operating Temperature: -40°C to +85°C
- Module Size: 10 × 10 × 1.80mm
- Number of Pads: 21
- Package: LG-MLGA-21 / MODULE-21
- MSL: Level 3
- Packaging: Tape & Reel
- Reel Quantity: 500 pcs
- RoHS Compliant: Yes
- Product Status: END OF LIFE / Discontinued
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