The AMD XCZU2EG-1SFVC784E is a high-performance Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) that combines powerful Arm-based processing cores with FPGA programmable logic in a single device. Featuring a quad-core Arm Cortex-A53 application processor, dual-core Arm Cortex-R5F real-time processor, and integrated Arm Mali-400 MP2 GPU, it provides a flexible heterogeneous computing platform for advanced embedded applications.
Built on 16nm FinFET+ technology, the XCZU2EG-1SFVC784E integrates approximately 103K system logic cells, 240 DSP slices, and 6.5Mb of programmable logic memory. Its -1 speed grade supports Arm Cortex-A53 frequencies up to 1.2GHz, enabling efficient processing for embedded control, signal processing, and hardware-accelerated computing applications.
The device supports multiple memory interfaces, including DDR4, LPDDR4, DDR3, DDR3L, and LPDDR3, along with high-speed connectivity such as Gigabit Ethernet, USB 3.0, and PCIe Gen2. Its tightly integrated processing system and programmable logic help reduce component count and enable customized hardware acceleration.
Housed in a 784-pin FCBGA package measuring 23 × 23mm, the XCZU2EG-1SFVC784E operates over an extended junction temperature range of 0°C to +100°C. It is suitable for industrial automation, embedded vision, intelligent edge devices, communication systems, and real-time control applications.
Key Specifications:
- Manufacturer: AMD (formerly Xilinx)
- Part Number: XCZU2EG-1SFVC784E
- Product Family: Zynq UltraScale+ MPSoC
- Device Series: ZU2EG
- Product Type: Multiprocessor System-on-Chip (MPSoC)
- Application Processor: Quad-Core Arm Cortex-A53
- Real-Time Processor: Dual-Core Arm Cortex-R5F
- Graphics Processor: Arm Mali-400 MP2
- Maximum APU Frequency: 1.2GHz
- Maximum RPU Frequency: 500MHz
- Maximum GPU Frequency: 600MHz
- System Logic Cells: Approximately 103K
- DSP Slices: 240
- Total Programmable Logic RAM: 6.5Mb
- On-Chip PS Memory: 256KB
- Maximum Programmable Logic I/O: 252
- Memory Interfaces: DDR4, LPDDR4, DDR3, DDR3L, LPDDR3
- Connectivity: Gigabit Ethernet, USB 3.0, PCIe Gen2, SPI, I2C, UART, CAN
- Process Technology: 16nm FinFET+
- Speed Grade: -1
- Temperature Grade: Extended (E)
- Operating Junction Temperature: 0°C to +100°C
- Package: 784-FCBGA
- Package Dimensions: 23 × 23mm
- Mounting Type: Surface Mount (SMD/SMT)
- Packaging: Tray
Typical Applications:
- Industrial automation and control
- Embedded computing systems
- Real-time signal processing
- Machine vision and image processing
- Intelligent edge computing
- Robotics and motion control
- Communication and networking equipment
- FPGA-based hardware acceleration
Reviews
There are no reviews yet.