The XC6SLX16-2CSG225C from AMD/Xilinx is a Spartan-6 LX field-programmable gate array manufactured on a cost- and power-optimized 45nm process. The logic-optimized LX family is suitable for interface bridging, industrial control, embedded processing, communication equipment, and digital-signal-processing systems.
The device integrates 14,579 logic cells, 2,278 slices, and 18,224 flip-flops. Each Spartan-6 slice contains four lookup tables and eight flip-flops for implementing combinational logic, sequential logic, arithmetic functions, state machines, and embedded-control circuits.
It includes 32 DSP48A1 slices, with each DSP slice incorporating an 18×18 multiplier, an adder, and an accumulator. These resources support digital filtering, multiply-accumulate operations, image processing, communication algorithms, and motor-control functions. The device also provides up to 136Kb of distributed RAM.
On-chip memory consists of 32 dual-port 18Kb block-RAM resources, providing a total capacity of 576Kb. Each 18Kb block can also operate as two independent 9Kb memories for FIFOs, data buffers, coefficient storage, and embedded-processor memory.
The XC6SLX16-2CSG225C is supplied in a 225-ball chip-scale BGA package measuring 13mm × 13mm with a 0.8mm ball pitch. This device-and-package combination provides 160 user I/Os across four I/O banks.
Two clock-management tiles provide a total of four digital clock managers and two phase-locked loops. The FPGA also integrates two memory-controller blocks; in the CSG225 package, memory-controller support is limited to an x8 data width.
Spartan-6 devices use SRAM-based configuration memory, so the configuration must be reloaded after power-up from an external memory device, processor, or JTAG interface. Supported configuration options include serial SPI, parallel configuration, and boundary-scan methods.
Within the ordering code, “−2” specifies the speed grade, “CSG225” identifies the lead-free 225-ball chip-scale BGA package, and the final “C” specifies the 0°C to +85°C commercial junction-temperature range. The −2 speed grade uses a 1.2V core supply. AMD currently states that Spartan-6 device support has been extended through at least 2030, although availability of the exact ordering code should be confirmed before procurement.
Key Specifications
- Manufacturer: AMD/Xilinx
- Manufacturer Part Number: XC6SLX16-2CSG225C
- Product Family: Spartan-6 LX
- Device Type: Field-Programmable Gate Array
- Process Technology: 45nm
- Logic Cells: 14,579
- Configurable Logic Slices: 2,278
- Flip-Flops: 18,224
- Resources per Slice: Four LUTs and Eight Flip-Flops
- Maximum Distributed RAM: 136Kb
- DSP48A1 Slices: 32
- Block RAM Resources: 32 × 18Kb
- Total Block RAM: 576Kb
- Clock-Management Tiles: 2
- Digital Clock Managers: 4
- Phase-Locked Loops: 2
- Memory-Controller Blocks: 2
- CSG225 Memory Interface Width: x8
- User I/O: 160
- I/O Banks: 4
- GTP Transceivers: None
- Core Voltage: 1.2V
- Speed Grade: −2
- Temperature Grade: Commercial
- Junction-Temperature Range: 0°C to +85°C
- Package: CSG225
- Package Type: 225-Ball Chip-Scale BGA
- Package Dimensions: 13mm × 13mm
- Ball Pitch: 0.8mm
- Mounting Type: Surface Mount
- Configuration Architecture: SRAM-Based
- Development Environment: Xilinx ISE Design Suite
Typical Applications
Suitable for industrial automation, interface bridging, communication equipment, video and image processing, digital signal processing, embedded control, data acquisition, motor control, instrumentation, and consumer electronics. Because this LX device does not integrate GTP high-speed serial transceivers, designs requiring PCI Express or multi-gigabit serial links should evaluate a Spartan-6 LXT or newer FPGA family.
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