The XQ4010E-4PG191M from Xilinx is a QPRO XQ4000E-family high-reliability field-programmable gate array based on a reprogrammable SRAM configuration architecture. It was manufactured with MIL-PRF-38535 Appendix A QML processing for military-temperature and high-reliability electronic systems.
The XQ4010E provides up to 10,000 logic gates or as much as 12,800 bits of on-chip RAM when its configurable resources are primarily used for memory. Its typical usable gate range is 7,000 to 20,000 gates.
The programmable core contains a 20×20 CLB matrix, providing 400 configurable logic blocks and 1,120 flip-flops. CLB function generators can implement combinational logic or operate as synchronous, asynchronous, or dual-port SelectRAM resources.
Additional architectural resources include dedicated high-speed carry logic, internal three-state buses, wide edge decoders, hierarchical routing, and eight global low-skew clock or signal-distribution networks. These features support counters, arithmetic circuits, state machines, FIFOs, register files, and interface-control logic.
The device supports up to 160 user I/Os. Outputs provide programmable slew rate and up to 12mA sink-current capability, while input pads can be configured with pull-up or pull-down resistors. IEEE 1149.1-compatible boundary-scan logic is also integrated.
XQ4010E devices operate from a nominal 5V supply, with a recommended range of 4.5V to 5.5V, and support TTL and CMOS input thresholds. Because configuration memory is SRAM-based, the FPGA must reload its binary configuration after power-up. Configuration readback, program verification, and internal-node observability are supported.
Within the ordering code, “−4” identifies the ceramic-package speed grade, “PG191” specifies a 191-pin ceramic pin-grid-array package, and the final “M” specifies a ceramic military-temperature rating from −55°C to +125°C case temperature.
Xilinx officially discontinued the XQ4010E-4PG191M and identified no direct replacement. Final orders ended in 2012 and final deliveries were scheduled no later than June 30, 2013. The device is therefore primarily suited to legacy-system maintenance, repair, and replacement inventories rather than new designs.
Key Specifications
- Manufacturer: AMD/Xilinx
- Manufacturer Part Number: XQ4010E-4PG191M
- Product Family: QPRO XQ4000E
- Device Type: Field-Programmable Gate Array
- Quality Processing: MIL-PRF-38535 QML
- Configuration Technology: SRAM
- Maximum Logic Gates: 10,000
- Typical Gate Range: 7,000 to 20,000
- Maximum On-Chip RAM: 12,800 Bits
- CLB Matrix: 20 × 20
- Configurable Logic Blocks: 400
- Flip-Flops: 1,120
- Maximum User I/O: 160
- Maximum Decode Inputs per Side: 60
- Global Low-Skew Networks: Eight
- Output Sink Current: Up to 12mA
- I/O Features: Programmable Slew Rate and Pull-Up/Pull-Down
- Boundary Scan: IEEE 1149.1
- Recommended Supply Voltage: 4.5V to 5.5V
- Nominal Supply Voltage: 5V
- Speed Grade: −4
- Package Code: PG191
- Package Type: 191-Pin Ceramic PGA
- Temperature Grade: M
- Operating Case Temperature: −55°C to +125°C
- Maximum Ceramic-Package Junction Temperature: +150°C
- Configuration Features: Binary Loading, Readback, and Verification
- Product Status: Obsolete / Discontinued
- Direct Manufacturer Replacement: None
Typical Applications
Suitable for legacy military controls, avionics, communication interfaces, industrial automation, data acquisition, state-machine control, protocol conversion, and auxiliary digital-processing logic. New designs should evaluate supply availability, configuration-memory requirements, legacy development-tool compatibility, and the redesign effort required for a modern FPGA.
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