The SN65HVD75DRBR from Texas Instruments is a low-power, half-duplex RS-485 transceiver integrating one differential driver and one differential receiver. The driver outputs and receiver inputs are internally connected to the same A and B bus pins for two-wire, multipoint communication networks.
The device operates from a nominal 3.3V supply, with a recommended voltage range of 3.0V to 3.6V, and supports signaling rates up to 20Mbps. Its D, DE, and RE logic inputs are 5V tolerant, allowing direct connection to either 3.3V or 5V controllers.
The transceiver supports a −7V to +12V bus common-mode range and a bus fault-protection range from −13V to +16.5V. The driver produces at least 1.5V of differential output across the specified 54Ω RS-485 load.
The SN65HVD75 uses a 3/20-unit-load receiver, allowing approximately 213 transceivers on a standards-compliant bus. TI describes the device as supporting more than 200 connected nodes.
Internal receiver biasing provides failsafe operation during open-circuit, short-circuit, and idle-bus conditions. In these invalid bus states, the receiver output remains at a defined logic-high level without requiring external failsafe-bias resistors. Receiver differential-input hysteresis is 80mV typical for improved noise rejection.
Bus protection includes ±12kV IEC 61000-4-2 contact discharge, ±12kV air-gap discharge, ±15kV IEC human-body-model protection, and ±4kV IEC 61000-4-4 electrical-fast-transient immunity. Driver short-circuit protection and thermal shutdown are also integrated.
Maximum operating quiescent supply current is approximately 950μA, while disabling both the driver and receiver reduces standby current to less than 2μA. Glitch-free power-up and power-down behavior helps prevent unwanted transitions on the RS-485 bus.
The SN65HVD75DRBR is supplied in an 8-pin VSON package, TI package code DRB, with a nominal 3.0mm × 3.0mm body. The exposed thermal pad should be connected according to TI’s recommended PCB layout. Junction-to-ambient thermal resistance for the DRB package is specified at 40°C/W.
The “R” suffix specifies large tape-and-reel packaging with 3,000 units per reel. The operating ambient-temperature range is −40°C to +125°C. The orderable device is RoHS and REACH compliant, uses a NiPdAu lead finish, and is rated MSL 1.
Key Specifications
- Manufacturer: Texas Instruments
- Manufacturer Part Number: SN65HVD75DRBR
- Device Type: RS-485 / RS-422 Transceiver
- Number of Drivers: One
- Number of Receivers: One
- Duplex Mode: Half Duplex
- Bus Configuration: Two-Wire Differential
- Nominal Supply Voltage: 3.3V
- Recommended Supply Range: 3.0V to 3.6V
- Maximum Signaling Rate: 20Mbps
- Logic Compatibility: 3.3V and 5V Controllers
- Bus Common-Mode Range: −7V to +12V
- Bus Fault-Protection Range: −13V to +16.5V
- Minimum Differential Output: 1.5V
- Minimum Differential Load: 54Ω
- Receiver Unit Load: 3/20 UL
- Maximum Bus Nodes: Approximately 213
- Receiver Hysteresis: 50mV Minimum, 80mV Typical
- Receiver Failsafe: Open, Shorted, and Idle Bus
- IEC Contact ESD Protection: ±12kV
- IEC Air-Gap ESD Protection: ±12kV
- IEC HBM Bus Protection: ±15kV
- IEC Fast-Transient Protection: ±4kV
- Maximum Operating Quiescent Current: 950μA
- Standby Current: Less Than 2μA
- Driver Enable: Active High
- Receiver Enable: Active Low
- Protection: ESD, Driver Short Circuit, and Thermal Shutdown
- Operating Ambient Temperature: −40°C to +125°C
- Maximum Operating Junction Temperature: +150°C
- Package: VSON-8
- TI Package Code: DRB
- Package Size: Approximately 3.0mm × 3.0mm
- Mounting Type: Surface Mount
- Packaging: Large Tape and Reel
- Standard Reel Quantity: 3,000 Units
- Moisture Sensitivity Level: MSL 1
- Lead Finish: NiPdAu
- Compliance: RoHS and REACH
- Product Status: Active
Typical Applications
Suitable for factory automation, PLCs, servo and motion control, industrial sensors, building automation, telecommunications infrastructure, instrumentation, encoder interfaces, and other high-speed multipoint RS-485 networks.
Cable impedance, termination, stub length, ground-potential difference, common-mode voltage, transient protection, supply decoupling, and exposed-pad PCB layout should be verified in the final design.
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