AMD Xilinx XC7Z010-1CLG400I Zynq-7000 Dual-Core Cortex-A9 667MHz 28K Logic SoC CLG400

The AMD Xilinx XC7Z010-1CLG400I is a Zynq-7000 programmable SoC integrating a dual-core Arm Cortex-A9 MPCore processing system with Artix-7-based FPGA programmable logic on a single device. This architecture combines processor software programmability with FPGA hardware acceleration. The -1 speed grade supports a maximum CPU frequency of 667MHz, making the device suitable for industrial control, embedded computing, machine vision, communications, data acquisition and hardware acceleration.

The XC7Z010 programmable logic provides 28K logic cells, 17,600 LUTs, 35,200 flip-flops, 2.1Mb of block RAM using 60 × 36Kb blocks, and 80 DSP slices. These resources support digital signal processing, real-time control, custom interfaces and parallel hardware acceleration.

The processing system integrates 32KB instruction and 32KB data L1 cache per processor, 512KB shared L2 cache and 256KB on-chip memory. External memory support includes DDR3, DDR3L, DDR2 and LPDDR2. Integrated peripherals include dual UART, dual CAN 2.0B, dual I²C, dual SPI, dual USB 2.0 OTG, dual Gigabit Ethernet and dual SD/SDIO, with AXI interfaces providing high-bandwidth connectivity between the processing system and programmable logic.

The XC7Z010-1CLG400I uses a CLG400 BGA package measuring 17 × 17mm with a 0.8mm ball pitch. In this package, the XC7Z010 provides 128 PS I/Os and 100 programmable-logic SelectIO pins. The I suffix denotes the industrial temperature grade, specified for a junction temperature range of -40°C to +100°C.

Key Features:

• Manufacturer: AMD Xilinx
• Part Number: XC7Z010-1CLG400I
• Family: Zynq-7000
• Device: Z-7010
• Device Type: Programmable SoC
• Processor: Dual-Core Arm Cortex-A9 MPCore
• Speed Grade: -1
• Maximum CPU Frequency: 667MHz
• Programmable Logic: Artix-7 Equivalent
• Logic Cells: 28K
• LUTs: 17,600
• Flip-Flops: 35,200
• Block RAM: 2.1Mb / 60 × 36Kb
• DSP Slices: 80
• L1 Cache: 32KB Instruction + 32KB Data per Core
• L2 Cache: 512KB
• On-Chip Memory: 256KB
• Memory Support: DDR3 / DDR3L / DDR2 / LPDDR2
• DMA Channels: 8
• UART: 2
• CAN 2.0B: 2
• I²C: 2
• SPI: 2
• USB 2.0 OTG: 2
• Gigabit Ethernet: 2
• SD/SDIO: 2
• PS I/O: 128
• PL SelectIO: 100
• Package: CLG400 BGA
• Package Size: 17 × 17mm
• Ball Pitch: 0.8mm
• Temperature Grade: Industrial
• Junction Temperature Range: -40°C to +100°C.