The XC7A200T-2FBG484I from Xilinx, now part of AMD, is an Artix-7 field-programmable gate array manufactured using a 28nm high-performance, low-power process. It integrates 215,360 logic cells, 33,650 CLB slices, 740 DSP48E1 slices, 13,140Kb of Block RAM, and up to 2,888Kb of distributed RAM, providing substantial resources for complex logic, parallel processing, and digital signal-processing designs.
The XC7A200T device contains 16 GTP transceivers, 10 clock-management tiles, one integrated PCI Express block, and one XADC block. In the specific FBG484 package configuration, the device provides four GTP transceivers and 285 user I/Os. Its integrated PCI Express block supports configurations up to x4 Gen2.
This part is supplied in a 484-ball FBG BGA package measuring approximately 23 × 23mm, with a 1.0mm ball pitch. The FBG484 and FGG484 packages are footprint-compatible, supporting greater flexibility in compatible PCB designs. The package is listed by AMD as lead-free.
The “-2” suffix identifies the speed grade and corresponds to the standard 1.0V speed specification. The final “I” identifies the industrial temperature grade, supporting a junction-temperature range from -40°C to +100°C. AMD lists the XC7A200T -2 speed grade as a production specification.
With its combination of programmable logic, DSP resources, on-chip memory, high-speed transceivers, and PCIe connectivity, the device is suitable for industrial control, machine vision, video and image processing, communications, data acquisition, test and measurement, digital signal processing, and FPGA-based hardware acceleration.
Key Specifications:
- Manufacturer: Xilinx / AMD
- Manufacturer Part Number: XC7A200T-2FBG484I
- Product Family: Artix-7
- Device Type: Field-Programmable Gate Array
- Process Technology: 28nm
- Logic Cells: 215,360
- CLB Slices: 33,650
- Maximum Distributed RAM: 2,888Kb
- DSP48E1 Slices: 740
- Total Block RAM: 13,140Kb
- 18Kb Block RAM Blocks: 730
- 36Kb Block RAM Blocks: 365
- Total Device GTP Resources: 16
- GTP Transceivers Available in FBG484: 4
- User I/O Available in FBG484: 285
- Clock Management Tiles: 10
- PCI Express Blocks: 1, supporting up to x4 Gen2
- XADC Blocks: 1
- Speed Grade: -2
- Core Voltage Speed Specification: 1.0V
- Temperature Grade: Industrial
- Junction Temperature Range: -40°C to +100°C
- Package: FBG484
- Package Dimensions: Approximately 23 × 23mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount
- Package Classification: Lead-Free
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