Xilinx XC7Z030-2SBG485I Zynq-7000 Dual-Core ARM FPGA SoC

$170.00

Xilinx XC7Z030-2SBG485I is a Zynq-7000 FPGA SoC featuring dual-core ARM Cortex-A9 processors, Kintex-7 programmable logic, 125K logic cells, and up to 800MHz processing speed. It supports -40°C to +100°C junction temperatures in an SBG485 BGA package.

Availability: 1000 in stock

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The XC7Z030-2SBG485I is a programmable system-on-chip (SoC) from the Xilinx Zynq-7000 family, now part of AMD. It integrates a dual-core ARM Cortex-A9 MPCore processing system with Kintex-7-based programmable logic (FPGA), combining embedded processing and hardware acceleration in a single device.

Featuring approximately 125K logic cells and processor speeds of up to 800MHz, this device supports complex data processing, real-time control, and parallel computing tasks. Its integrated processing system (PS) and programmable logic (PL) provide flexibility, processing performance, and high integration for advanced embedded applications.

The XC7Z030-2SBG485I comes in an SBG485 Flip-Chip Lidless BGA package, measuring 19 × 19mm with a 0.8mm ball pitch. It supports an industrial junction temperature range of -40°C to +100°C, making it suitable for industrial automation, communication equipment, machine vision, video processing, and embedded control systems.

Key Features:

  • Manufacturer: Xilinx (AMD)
  • Part Number: XC7Z030-2SBG485I
  • Series: Zynq-7000
  • Product Type: Programmable System-on-Chip (SoC)
  • Processor Architecture: Dual-Core ARM Cortex-A9 MPCore
  • Processor Frequency: Up to 800MHz
  • FPGA Architecture: Kintex-7
  • Logic Cells: Approximately 125K
  • Speed Grade: -2
  • Operating Temperature: -40°C to +100°C (Junction)
  • Package: SBG485 Flip-Chip Lidless BGA
  • Package Dimensions: 19 × 19mm
  • Ball Pitch: 0.8mm
  • Mounting Type: Surface Mount (SMD/SMT)
Manufacturer

AMD/XILINX

MPN

XC7Z030-2SBG485I

Packaging

Full Tray

Quantity per Reel

84pcs

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